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Review article

An Integrated Approach to Power Electronics Systems

Fred C. Lee
Jacobus D. van Wyk
Dushan Boroyevich
Thomas Jahns
Robert D. Lorenz
T. Paul Chow
Ron Gutmann
Peter Barbosa

Fulltext: english, pdf (1 MB) pages 5-20 downloads: 3.804* cite
APA 6th Edition
Lee, F.C., van Wyk, J.D., Boroyevich, D., Jahns, T., Lorenz, R.D., Chow, T.P., ... Barbosa, P. (2003). An Integrated Approach to Power Electronics Systems. Automatika, 44 (1-2), 5-20. Retrieved from https://hrcak.srce.hr/6752
MLA 8th Edition
Lee, Fred C., et al. "An Integrated Approach to Power Electronics Systems." Automatika, vol. 44, no. 1-2, 2003, pp. 5-20. https://hrcak.srce.hr/6752. Accessed 7 Dec. 2021.
Chicago 17th Edition
Lee, Fred C., Jacobus D. van Wyk, Dushan Boroyevich, Thomas Jahns, Robert D. Lorenz, T. Paul Chow, Ron Gutmann and Peter Barbosa. "An Integrated Approach to Power Electronics Systems." Automatika 44, no. 1-2 (2003): 5-20. https://hrcak.srce.hr/6752
Harvard
Lee, F.C., et al. (2003). 'An Integrated Approach to Power Electronics Systems', Automatika, 44(1-2), pp. 5-20. Available at: https://hrcak.srce.hr/6752 (Accessed 07 December 2021)
Vancouver
Lee FC, van Wyk JD, Boroyevich D, Jahns T, Lorenz RD, Chow TP, et al. An Integrated Approach to Power Electronics Systems. Automatika [Internet]. 2003 [cited 2021 December 07];44(1-2):5-20. Available from: https://hrcak.srce.hr/6752
IEEE
F.C. Lee, et al., "An Integrated Approach to Power Electronics Systems", Automatika, vol.44, no. 1-2, pp. 5-20, 2003. [Online]. Available: https://hrcak.srce.hr/6752. [Accessed: 07 December 2021]

Abstracts
Today's power electronics systems are typically manufactured using non-standard parts, resulting in labor-intensive manufacturing processes, increased cost and poor reliability. As a possible way to overcome these problems, this paper discusses an integrated approach to design and manufacture power electronics systems to improve performance, reliability and cost effectiveness. Addressed in the paper are the technologies being developed for integration of both power supplies and motor drives. These technologies include the planar metalization to eliminate bonding wires, the integration of power passives, the integration of current sensors, the development of power devices to facilitate integration as well as to improve performance, and the integration of necessary CAD tools to address the multidisciplinary aspects of integrated systems. The development of Integrated Power Electronics Modules (IPEMs) is demonstrated for two applications: (1) 1 kW asymmetrical half-bridge DC-DC converter and (2) 1–3 kW motor drive for heating, ventilation and air conditioning (HVAC). Electrical and thermal design tradeoffs of IPEMs and related enabling technologies are described in the paper.

Keywords
packaging; power integrated circuits; power semiconductor devices; sensors; and integrated design methodology

Hrčak ID: 6752

URI
https://hrcak.srce.hr/6752

[croatian]

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