Tehnički vjesnik, Vol. 19 No. 1, 2012.
Izvorni znanstveni članak
Growth of the IMC at the interface of SnAgCuBi (Bi = 0,5; 1,0) solder joints with Cu substrate
Beáta Šimeková
; Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, Paulínska 16, 91701 Trnava, Slovakia
Erika Hodúlová
; Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, Paulínska 16, 91701 Trnava, Slovakia
Ingrid Kovaříková
; Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, Paulínska 16, 91701 Trnava, Slovakia
Marián Palcut
; Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, Paulínska 16, 91701 Trnava, Slovakia
Koloman Ulrich
; Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, Paulínska 16, 91701 Trnava, Slovakia
Sažetak
The effects of Bi addition on the intermetallic phase formation in the lead-free solder joints of Sn-Ag-0.5Cu0.5Bi (SAC0,5B) and Sn-Ag-0.5Cu-1.0Bi (SAC1,0B), composition given in weight (measured in %), with copper substrate are studied. The soldering of the copper plate was conducted at 255 °C for 5 s. The joints were subsequently aged at temperatures of 100 °C, 130 °C and 160 °C for 1, 3, 7, 15 days in a convection oven. The aged interfaces were analysed by the optical microscopy and energy dispersive x-ray spectrometry (EDX, JEOL-JXA-840A) microanalysis. Two intermetallic layers are observed at the interface – Cu3Sn and Cu6Sn5. Cu6Sn5 is formed during soldering. Cu3Sn is formed during solid state ageing. Bi decreases the growth rate of Cu3Sn since it can possibly inhibit Sn diffusion along the grain boundaries. The mechanism of the Cu6Sn5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.
Ključne riječi
lead-free solder; intermetallic compound; annealing
Hrčak ID:
79165
URI
Datum izdavanja:
29.3.2012.
Posjeta: 1.979 *