hrcak mascot   Srce   HID

Prethodno priopćenje

USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT

Patrik Nemec ; Faculty of Mechanical Engineering, University of Žilina, Slovakia
Milan Malcho ; Faculty of Mechanical Engineering, University of Žilina, Slovakia
Martin Smitka ; Faculty of Mechanical Engineering, University of Žilina, Slovakia

Puni tekst: engleski, pdf (301 KB) str. 177-182 preuzimanja: 172* citiraj
APA 6th Edition
Nemec, P., Malcho, M. i Smitka, M. (2015). USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT. The holistic approach to environment, 5 (4), 177-182. Preuzeto s https://hrcak.srce.hr/150826
MLA 8th Edition
Nemec, Patrik, et al. "USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT." The holistic approach to environment, vol. 5, br. 4, 2015, str. 177-182. https://hrcak.srce.hr/150826. Citirano 29.01.2020.
Chicago 17th Edition
Nemec, Patrik, Milan Malcho i Martin Smitka. "USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT." The holistic approach to environment 5, br. 4 (2015): 177-182. https://hrcak.srce.hr/150826
Harvard
Nemec, P., Malcho, M., i Smitka, M. (2015). 'USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT', The holistic approach to environment, 5(4), str. 177-182. Preuzeto s: https://hrcak.srce.hr/150826 (Datum pristupa: 29.01.2020.)
Vancouver
Nemec P, Malcho M, Smitka M. USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT. The holistic approach to environment [Internet]. 2015 [pristupljeno 29.01.2020.];5(4):177-182. Dostupno na: https://hrcak.srce.hr/150826
IEEE
P. Nemec, M. Malcho i M. Smitka, "USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT", The holistic approach to environment, vol.5, br. 4, str. 177-182, 2015. [Online]. Dostupno na: https://hrcak.srce.hr/150826. [Citirano: 29.01.2020.]

Sažetak
Loop thermosyphon is a simple and reliable device providing several times higher heat transfer than convectional coolers used in cooling electronic. The paper deals with the cooling of power electronic component by means of this device. The main object of the paper is design and construction of the device to provide heat removal from the electronic component. Paper describes function principle of loop thermosyphon, testing of the function and measurement of cooling efficiency in dependence on input electric power of the electronic component. The findings from measurement of loop thermosyphon cooling efficiency are compared with natural convective alumina cooler on the end of paper.

Ključne riječi
loop thermosyphon; heat transfer; electronic component; temperature; measurement

Hrčak ID: 150826

URI
https://hrcak.srce.hr/150826

Posjeta: 295 *