Letter to the Editor

Mechanical twinning in polycrystalline copper at 20 K

Syed M. Raza ; Department of Physics, University of Baluchistan, Quetta, Pakistan
Naeem Farooqui ; Department of Physics, University of Baluchistan, Quetta, Pakistan
Syed. B. H. Abidi ; Department of Physics, University of Baluchistan, Quetta, Pakistan
Abdul. K. Khan ; Department of Physics, University of Baluchistan, Quetta, Pakistan

Abstract

Recent observations of mechanical twins in the deformation process of polycrystalline copper at 20 K suggest that twinning is a characteristic of low-temperature deformation and, occurs by the movement of partial dislocations. At low strains, cross-slip is partially expected due to widening of stacking fault ribbon. Cross-slip is inhibited at larger strains due to strain enhancement effect. The latent hardening properties of copper are extended for the prediction of general characteristics of plastic flow. Plastic accomodation in polycrystals will then occur by contiguous single or double slip domains within the grains. It is concluded that the twin surfaces are formed due to strain-enhancement and stress-raising effects.

Keywords

Hrčak ID:

329220

URI

https://hrcak.srce.hr/329220

Publication date:

3.12.1984.

Article data in other languages: croatian

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