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Croatica Chemica Acta, Vol. 94 No. 1, 2021.

Original scientific paper

https://doi.org/10.5562/cca3757

Influence of Bitartrate Ion Concentration in the Copper Electrodeposition Onto a Polycrystalline Gold Electrode

Miguel Hernández orcid id orcid.org/0000-0003-2649-8401 ; Universidad Autónoma del Estado de Hidalgo. Academic Area of Chemistry. Carretera Pachuca-Tulancingo Km. 4.5 Mineral de la Reforma México
Giaan A. Álvarez-Romero ; Universidad Autónoma del Estado de Hidalgo. Academic Area of Chemistry. Carretera Pachuca-Tulancingo Km. 4.5 Mineral de la Reforma México
Margarita Rivera ; Instituto de Física, Universidad Nacional Autónoma de México, Ciudad de Mexico, 04510, México
Simplicio González-Montiel ; Universidad Autónoma del Estado de Hidalgo. Academic Area of Chemistry. Carretera Pachuca-Tulancingo Km. 4.5 Mineral de la Reforma México
Clara H. Rios-Reyes ; Universidad La Salle Pachuca. Calle Belisario Domínguez 202, Centro, 42000 Pachuca de Soto, Hgo., México
Luis H. Mendoza-Huizar orcid id orcid.org/0000-0003-2373-4624 ; Universidad Autónoma del Estado de Hidalgo. Academic Area of Chemistry. Carretera Pachuca-Tulancingo Km. 4.5 Mineral de la Reforma México

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Abstract

In the present work, the influence of the concentration of bitartrate ions (HT) on the copper electrodeposition process was analyzed. The study was carried out from an aqueous solution containing 0.001 M of CuX (where X = (NO3–)2 ,(Cl–)2, SO42–) and x M KHT (where x = 0.005 M, 0.01 M, and 0.015 M). From voltammetric and chronoamperometric studies, the results indicate that copper electrodeposition is a diffusion-controlled process. The current density transients were well described through a kinetic mechanism involving capacitive and faradaic contributions. The diffusion coefficient values of Cu1+ and Cu2+ result to be similar at the different concentration values of potassium bitartrate used in this work.

This work is licensed under a Creative Commons Attribution 4.0 International License.

Keywords

copper; acid bitartrate ions; kinetic; copper; electrodeposition

Hrčak ID:

259452

URI

https://hrcak.srce.hr/259452

Publication date:

28.6.2021.

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