Technical gazette, Vol. 29 No. 2, 2022.
Preliminary communication
https://doi.org/10.17559/TV-20210201120826
Investigation of Abrasive Cutting of Ceramic Matrix Composites Based on Thin-Walled Elements Using Diamond Wire
Magdalena Wiśniewska*
; Departament of Mechanical Engineering, Wrocław University of Science and Technology, Ignacego Łukasiewicza 5, 50-371 Wrocław, Poland
Mateusz Pudłowski
; Gühring Sp. z o.o., Al. Zagłębia Dąbrowskiego 21, 41-300 Dąbrowa Górnicza, Poland
Christian Gauggel
; Gühring KG, Winterlinger Straße 12, 72488 Sigmaringen-Laiz, Germany
Dariusz Poroś
; Departament of Mechanical Engineering, Wrocław University of Science and Technology, Ignacego Łukasiewicza 5, 50-371 Wrocław, Poland
Abstract
Ceramic Matrix Composites (CMC) are innovative materials used in industries such as aviation, space and automotive because of their exceptional properties. However, an incorrect choice of the cutting method for such type of material may lead to delamination of a composite structure and reduce structure strength shortening its service life. The most commonly used forms of processing these materials are laser cutting technologies, water jet cutting or electro erosive machining. This prospective study was designed to investigate the possibilities and usefulness of applying the abrasive diamond wire for cutting CMC composites, specifically composite pipes made of C/C-SiC with the Liquid Silicone Infiltration (LSI). A complex microstructure of this material translates into significant machining difficulties. This paper presents the results of the preliminary tests and describes the impact of technological parameters on surface quality, edge damage and tool behaviour and wear. Briefly, a wire-reinforced permanently with a diamond grain of 120/140 μm was selected. The cutting speed between 5 and 15 m/s and the wire pressure for two values of 4,4 N and 5,5 N (they were selected experimentally) were used as variable parameters. Expectations for cutting effects focused on assessing edge quality (potential edge chipping), surface quality and answering the question of whether the method promotes material delamination. Preliminary results have shown that cutting with diamond wire is well suited for CMC materials and a surface quality of less than 2 μm is fully satisfactory. It has been shown that the obtained values of surface roughness correspond to industrial conditions and are competitive or even better than for other machining technologies. Despite the initial satisfactory results, the research requires further development.
Keywords
abrasive diamond wire; CMC; CMC cutting methods; surface quality
Hrčak ID:
272617
URI
Publication date:
15.4.2022.
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