Metallurgy, Vol. 61 No. 3-4, 2022.
Original scientific paper
Modification of the Cu-ETP copper surface layer with chromium by physical vapor deposition (PvD) and diffusion annealing
M. Poreba
; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
M. Pytel
; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
M. Drajewicz
; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
W. Ziaja
; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
M. Góral
; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
Abstract
In the study, an attempt was made to increase durability of copper by creating a surface layer saturated or supersaturated with chromium only in the area of the highest thermo-mechanical loads during the welding process. There was developed a two-stage technological process, consisting of: application of chrome coating of the thickness approx. 1 µm on the Cu-ETP copper surface using the PVD method, and then performing the process of its diffusion by annealing at a temperature of 950°C in the vacuum. As a result, a diffusion CuCr layer with a thickness of approx. 20 µm was obtained, with hardness of approx. 120 HV0,01.
Keywords
Cu-ETP and Cu-OF copper; surface; CuCr layer; PVD; annealing; x-ray analysis; scanning electron microscopy (SEM); energy dispresive spectroscopy (EDS)
Hrčak ID:
273838
URI
Publication date:
1.7.2022.
Visits: 534 *