Original scientific paper

Modification of the Cu-ETP copper surface layer with chromium by physical vapor deposition (PvD) and diffusion annealing

M. Poreba ; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
M. Pytel ; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
M. Drajewicz ; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
W. Ziaja ; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland
M. Góral ; Department of Materials Science, Rzeszow University of Technology, Rzeszow, Poland

Abstract

In the study, an attempt was made to increase durability of copper by creating a surface layer saturated or supersaturated with chromium only in the area of the highest thermo-mechanical loads during the welding process. There was developed a two-stage technological process, consisting of: application of chrome coating of the thickness approx. 1 µm on the Cu-ETP copper surface using the PVD method, and then performing the process of its diffusion by annealing at a temperature of 950°C in the vacuum. As a result, a diffusion CuCr layer with a thickness of approx. 20 µm was obtained, with hardness of approx. 120 HV0,01.

Keywords

Cu-ETP and Cu-OF copper; surface; CuCr layer; PVD; annealing; x-ray analysis; scanning electron microscopy (SEM); energy dispresive spectroscopy (EDS)

Hrčak ID:

273838

URI

https://hrcak.srce.hr/273838

Publication date:

1.7.2022.

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