Preliminary communication

Research of the alloying additives content in high-silver solders on their susceptibility to soldering process and basic performance properties

N. Lamla orcid.org/0000-0002-7826-6672 ; AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Cracow, Poland *
P. Kwaśniewski orcid.org/0000-0002-7826-6672 ; AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Cracow, Poland
G. Kiesiewicz orcid.org/0000-0001-9518-5498 ; AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Cracow, Poland
M. Sadzikowski ; AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Cracow, Poland
K. Franczak orcid.org/0000-0002-0135-3700 ; AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Cracow, Poland

* Corresponding author.

Abstract

Copper and its alloys with steel, including stainless steel, are soldered using brazing materials CuAgZn and CuAg- ZnSn. They are used for making connections in heating, cooling and renewable energy sources (RES) devices. The elements used in the above-mentioned alloys affect wettability, castability, corrosion resistance, impact resistance, plasticity, stress resistance and also increase the melting point of the solder. The article presents the impact of the percentage of alloying additives covered by the EN ISO 17672 standard on performance and susceptibility to soldering brazing materials Ag44 and Ag40Sn.

Keywords

brazing; CuAgZnSn; soldering; electrical properties; mechanical properties

Hrčak ID:

312340

URI

https://hrcak.srce.hr/312340

Publication date:

1.4.2024.

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