Preliminary communication

USING LOOP THERMOSYPHON TO WASTE HEAT REMOVAL FROM POWER ELECTRONIC COMPONENT

Patrik Nemec ; Faculty of Mechanical Engineering, University of Žilina, Slovakia
Milan Malcho ; Faculty of Mechanical Engineering, University of Žilina, Slovakia
Martin Smitka ; Faculty of Mechanical Engineering, University of Žilina, Slovakia

Abstract

Loop thermosyphon is a simple and reliable device providing several times higher heat transfer than convectional coolers used in cooling electronic. The paper deals with the cooling of power electronic component by means of this device. The main object of the paper is design and construction of the device to provide heat removal from the electronic component. Paper describes function principle of loop thermosyphon, testing of the function and measurement of cooling efficiency in dependence on input electric power of the electronic component. The findings from measurement of loop thermosyphon cooling efficiency are compared with natural convective alumina cooler on the end of paper.

Keywords

loop thermosyphon; heat transfer; electronic component; temperature; measurement

Hrčak ID:

150826

URI

https://hrcak.srce.hr/150826

Publication date:

25.12.2015.

Visits: 1.026 *