Professional paper

THE INFLUENCE OF GRAVITY TO REMOVE WASTE HEAT OF POWER ELECTRONIC COMPONENTS USING LHP

Martin Smitka ; Faculty of Mechanical Engineering, University of Žilina, Slovakia
Zuzana Kolková ; Faculty of Mechanical Engineering, University of Žilina, Slovakia
Milan Malcho ; Faculty of Mechanical Engineering, University of Žilina, Slovakia

Abstract

Given the rapid progress in the electronics industry, the thermal management of electronics components becomes an important and serious issue. Natural and forced cooling for heat sink are often deficient. One possibility of heat dissipation for high heat flux is using loop heat pipe. The loop heat pipe (LHP) is a two-phase device with extremely high effective thermal conductivity that utilizes the thermodynamic pressure difference to circulate fluid. It was invented in Russia in the early 1980’s. This work deals with the design of LHP for cooling of Insulated gate bipolar transistor and impact of tilt angle of LHP on temperature of transistor. The maximum temperature of transistor is 100°C. LHP is made of copper pipe. Working fluid is distilled water.

Keywords

loop heat pipe; cooling; electronic component; tilt angle

Hrčak ID:

136005

URI

https://hrcak.srce.hr/136005

Publication date:

1.3.2015.

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