Izvorni znanstveni članak

https://doi.org/10.21278/TOF.453009319

Simulation and Analysis of the Heating Performance of an Embossing-Head Utilizing Electromagnetic Induction Heating

Jun-yao Wang ; School of Mechanical Engineering, Northeast Electric Power University, Jilin, China
Qi Hou ; School of Mechanical Engineering, Northeast Electric Power University, Jilin, China
Fu-wang Wang ; School of Mechanical Engineering, Northeast Electric Power University, Jilin, China
Bo You ; School of Aeronautical Engineering, Ji Lin Institute of Chemical Technology, Jilin, China
Heng-yi Yuan ; College of mechanical engineering, Ji lin engineering normal University, Changchun, Jilin, China

Sažetak

In this paper, the embossing head of a hot embossing machine which uses the electromagnetic induction heating is studied. In order to determine the relevant performance parameters of the embossing head, i.e. the coil distribution position, material of the embossing head, heating frequency, cooling water velocity, simulation and analysis are carried out based on the finite element method in ANSYS/Workbench. The results demonstrate that a distance of 1 mm between the coil and the embossing head, copper as the embossing head material, a frequency of 8500Hz, and a water velocity of 1.2 m·s^(-1) satisfy the requirements, including those of a hot-pressing temperature of 150℃ and a demoulding temperature of 60℃. Simultaneously, the chip processing-cycle exploiting this embossing head is reduced by a factor of three. Compared with the existing heating methods of embossing heads, the electromagnetic induction heating method presented in this paper has the advantages of high efficiency, high heating rate, and long life.

Ključne riječi

Simulation and analysis; Heating performance parameters; Embossing head; Electromagnetic induction heating; ANSYS

Hrčak ID:

266001

URI

https://hrcak.srce.hr/266001

Datum izdavanja:

1.12.2021.

Posjeta: 1.258 *