Izvorni znanstveni članak

https://doi.org/10.15255/KUI.2015.048

Effects of the Curing Process on the Residual Stress in Solar Cell Module

Zidu Li ; School of Materials Science and Engineering, Tianjin Polytechnic University, 300 387 Tianjin, Kina
Pei Wang ; Auditing Department, Tianjin Polytechnic University, 300 387 Tianjin, Kina
Jianfeng Gao ; The 18^th Research Institute, China Electronics Technology Group Corporation, 300 381 Tianjin, Kina
Haiwen Jin ; The 18^th Research Institute, China Electronics Technology Group Corporation, 300 381 Tianjin, Kina
Songzhe Liu ; The 18^th Research Institute, China Electronics Technology Group Corporation, 300 381 Tianjin, Kina
Juncheng Liu ; School of Materials Science and Engineering, Tianjin Polytechnic University, 300 387 Tianjin, Kina

Sažetak

Panels using solar power require high reliability, and the residual stress in the solar panel has an important effect on its reliability and lifetime. The finite element method was adopted to simulate the impacts of the rectangular solar panel encapsulation process parameters, such as the elastic modulus, the thickness of adhesive, and the curing temperature on the residual stress in the solar cell module. The results show that the residual stress in the solar cell module increases linearly with the increase in these three factors. The residual strain is consistent with that of the stress. The generation mechanism and distribution evolution of stress are discussed in detail. Both the thickness and the elastic modulus of the silicone rubber have significant impact on the residual stress. However, the influence of the curing temperature is less observable.

Ključne riječi

solar cell module; curing process; residual stress; finite element method; elastic modulus

Hrčak ID:

154249

URI

https://hrcak.srce.hr/154249

Datum izdavanja:

23.3.2016.

Podaci na drugim jezicima: hrvatski

Posjeta: 1.679 *