Review article

An Integrated Approach to Power Electronics Systems

Fred C. Lee
Jacobus D. van Wyk
Dushan Boroyevich
Thomas Jahns
Robert D. Lorenz
T. Paul Chow
Ron Gutmann
Peter Barbosa

Abstract

Today's power electronics systems are typically manufactured using non-standard parts, resulting in labor-intensive manufacturing processes, increased cost and poor reliability. As a possible way to overcome these problems, this paper discusses an integrated approach to design and manufacture power electronics systems to improve performance, reliability and cost effectiveness. Addressed in the paper are the technologies being developed for integration of both power supplies and motor drives. These technologies include the planar metalization to eliminate bonding wires, the integration of power passives, the integration of current sensors, the development of power devices to facilitate integration as well as to improve performance, and the integration of necessary CAD tools to address the multidisciplinary aspects of integrated systems. The development of Integrated Power Electronics Modules (IPEMs) is demonstrated for two applications: (1) 1 kW asymmetrical half-bridge DC-DC converter and (2) 1–3 kW motor drive for heating, ventilation and air conditioning (HVAC). Electrical and thermal design tradeoffs of IPEMs and related enabling technologies are described in the paper.

Keywords

packaging; power integrated circuits; power semiconductor devices; sensors; and integrated design methodology

Hrčak ID:

6752

URI

https://hrcak.srce.hr/6752

Publication date:

3.12.2003.

Article data in other languages: croatian

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