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Engineering Review : International journal for publishing of original researches from the aspect of structural analysis, materials and new technologies in the field of mechanical engineering, shipbuilding, fundamental engineering sciences, computer sciences, electrical engin, Vol. 34 No. 2, 2014.

Original scientific paper

Effect of Ag nanopowders on microstructure, hardness and elastic modulus of Sn-Bi solders

Xiaochun Lv
Peng He
Feng Pan
Bing Du
Fengjiao Lu
Yiyu Qian

Full text: english PDF 477 Kb

page 63-68

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Abstract

This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn distribution in comparison with those of Sn57Bi1Ag solder. Nanoindentation test results show that the addition of Ag nanopowders has greatly enhanced the mechanical properties of Sn58Bi solder, i.e., it exhibits 13-30% increase in hardness and 10-22% increase in modulus of the composite solder. Besides, hardness and elastic modulus of solder are dependent on the size, distribution and the quantity of the second-phase.

Keywords

Ag nanopowders；composite solder；microstructure；nanoindentation test

Hrčak ID:

122364

URI

https://hrcak.srce.hr/122364

Publication date:

4.6.2014.

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