Izvorni znanstveni članak
Soldering of Aluminum matrix composites SiCp/A356 and Kovar alloy
Zeng Gao
; School of Materials Science and Engineering, Henan Polytechnic University
Ji-tai Niu
; School of Materials Science and Engineering, Henan Polytechnic University
Shun-cheng Yang
; ZJXH Energy Equipment Science Limited Company
Xi-tao Wang
; School of Materials Science and Engineering, Henan Polytechnic University
Dong-feng Cheng
; School of Materials Science and Engineering, Henan Polytechnic University
Sažetak
Aluminum matrix composites containing 55% SiC particle reinforcing phase/SiC reinforcement phase particle and Kovar alloy 4J29 were chosen as the base metals. After nickel plating on the surface of SiCp/Al, two kinds of materials were soldered together by using Zn-Cd-Ag-Cu as the filler metal and ZnCl2 as the flux at the temperature of 420 °C in an argon atmosphere for 5 minutes. The interfacial microstructures and fracture surfaces were investigated with a scanning electron microscope (SEM). The result shows that the electroplating nickel on the surface of SiCp/Al can improve the weldability of fillers in the composites. There are transition layers not only between the filler and Kovar alloy, but also between the filler metal and nickel layer, which shows that the filler metal, the nickel layer, the composites and Kovar alloy can be joined by the diffusion mechanism. The fracture analysis shows that the fracture is mainly located at the side of composites near the electroplating nickel layer.
Ključne riječi
soldering; Aluminum metal matrix composites; Kovar alloy; microstructure; fracture
Hrčak ID:
104177
URI
Datum izdavanja:
21.6.2013.
Posjeta: 1.562 *